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No other industry in the world evolves as quickly as the electronics industry. Motivated by consumer demand, next-generation electronics assembly and packaging applications are constantly becoming smaller, faster and less costly. The iCure thermal spot curing system and accessories play a key role in this drive to constantly push the envelope when it comes to device packaging.
Our products make it possible to cure tiny quantities of thermal adhesives with the utmost precision in seconds while guaranteeing permanent bonding strength. IRphotonics has pioneered a new thermal spot curing system enabling novel device packaging methods and opens the door to an entire new range of products that can be manufactured with less rework & fewer rejects.
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